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The door actuator chips provide advanced door control function with the main features as follows:
1. Upgradable solutions which meet the various requirements for the integrated electronic architecture of vehicle door.
2. Power management functions.
3. Embedded CAN and LIN transceivers.
4. Transferring data via SPI bus for control and diagnosics
5. Low-power chip packaging with excellent heat dissipation.
Support the driving of all door module loads, such as rearview mirror adjustment folding, heating, door locking, window lifting and lowering, and automatic dimming mirror glass control.
| Model | Type | Applications | Mirror Adj. | Mirror Fold | Mirror Heater | Lock | Dead Lock | EC Glass | Window Lift | Power Management | Communication Interface | Output IO | Operating Temperature Range TA（℃） | Voltage（V） | CAN Transceiver | LIN Transceiver | Certification/Functional Safety Level | Package | Benchmarking | Mass Production Time |
| CCL1100B | Mixed Signal Chips | Door Actuator | (2000mΩ,0.5A) | (300mΩ,3A) | Supporting | (100mΩ,7.5A) | (300mΩ,3A) | Supporting | Supporting | Supporting | SPI | 15 | -40~150(junction temperature) | 5.4~20 | 1 | 1 | AEC-Q100 | LQFP64 | L99DZ100G/GP | 2024Q1 |
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